Original Technology – Okabe Mica Co., Ltd. | Japanese mica material manufacturer

Flaking and paper making technologies

Important technology to produce high quality mica plates or tapes
Available for the continuous production of inorganic papers with less strength
Technology to maintain a constant concentration of inorganic particle suspension and supply a controlled amount of suspension to paper making equipment
Technology to reel softly and continuously

Results from long-term basic researches led to improvement of quality.

What are the values that customers have come to expect and require?

Technology to laminate mica and various materials continuously
Technology to apply binders on materials with less strength
Technology to apply binders only on one side of materials having a property susceptible to impregnation
Available for various materials such as a film, glass cloth, paper, non-woven fabric, etc.

We realized new production that could not be done in the past by a change in thinking.

Technology to cut mica tape to a customer’s requested width or shape
Available for slitting mica tape that is an inorganic substance from 5 mm of width onward
Available for production of 10,000-m-long tape

Technology mainly used for the production of mica plates
Available for a wide range of thicknesses [0.04 to 50 mm]
Available for the production of laminated plates in various sizes [0.5 to 4 m² (0.5 × 1 to 1.3 × 3 m)]

From materials to functional units
~ Utilizing characteristics of mica ~

Technology to impregnate various materials with binders or to dry binders on various materials
Demonstrates a high drying capability for solvents
Temperature controlling technology to turn a base material impregnated with binders into a semi-cured state

We are also making efforts to enter a new field in addition to electric insulation materials.
~ Development of a semiconductive sheet ~

Technology to punch mica plates into various shapes
Applying pressure to processed materials using punching dies to process them in customers’ requested shapes

Design of punching dies optimized for mica plates and materials
Reduction of the design time and speedy response by designing punching dies in-house
Improvement of cost-effectiveness by reducing design cost

Machining center, milling cutter, lathe
Know-how cultivated by handling mica plate that is brittle and difficult to process

Taking on the task of processing customers’ requested shapes
Available for cylindrical forms or bending processing, in addition to flat plates